PRODUCT DESCRIPTION
RF-008T is formulated chemical product with a proprietary activator, a very active, low solids content, no clean flux with a small additon percentage or resin that enhanced thermal stability, while maintaining a high level of long-term electrical reliability.This special characteristic is good for copper and soldering layer surface wetting effect. After wave soldering, RF-008T leaves a low level of non-tacky residue, which is easily penetrable in pin testing.
FEATURES & BENEFITS *Highly active for excellent soldering and low defect rates. *Low level of non-tacky residue to reduce interference with pin testing. *Cleaning is not required which reduces operating costs. *Reduces the surface tension between solder mask and solder to significantly reduce solder ball frequency. *Meets Bellcore requirements for long-term electrical reliability.
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Product Unit Per Packing US$/Pack No clean Lead gallon 5 gallon/barrel US$66 Free Rosin Flux RF-008T specific for wave solderifng
APPLICATION GUIDELINES RF-008T is formulated chemical product to be applied by foam, wave or spray methods.The rosin flux spraying layer density and its evenness is the success key of its application. Recommend spraying layer density from 500 to 1500 mirco gram per square inch in order to maintain consistent soldering performance and electrical reliability. More important, it is to begin the process with circuit boards and components that meet established requirements for solderability and ionic cleanliness.The heating temperature is the key factor of all elements such as the conveyor speed, component or circuit board etc. During the wave soldering, the top side circuit board preheated temperature is 190 - 240F (88-115C) and the bottom side board preheated temperature is 250 - 325F (121 - 163C).
PHYSICAL CHARACTERISTIC Out look transparent, clear amber colour liquid Specific gravity(25C) 0.798 +/- 0.005 Solid content 27 Flashing point 17C testing method : closed environment
PH value | 3.3 (5% aq) |
Steam pressure | 33 MMHg @ 20C |
Boiling point | 82 C (180F ) |
Explosion limit | Upper Explosion Limit (UEL) -12% Lower Explosion Limit (LEL) - 2.0% |
RELIABILITY TEST Copper mirror test passed Copper corrosion test passed Silver Chromate Paper test passed Surface insulation resistance 10 ohm at (85C,humidity 85%,7days
| Adhesive | 12cps |
| Halide | none |
| Dry test | passed |
| Water solution resistance | 5000 ohms cm |
| Surface insulation resistance | start > 10x12 ohm 96 hours ; after > 10x12ohm |
| Dispread rate | 90% |
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HEALTH & SAFETY Inhalation of the flux solvent and volitalized a activator fumes which are generated at soldering temperatures may cause headaches, dizziness and nausea.Suitable fume extraction equipment should be used to remove the flux from the work area. An exhaust at the exit end of the wave soldering machine may also needed to completely capture the fumes. Soserve precautions during handling and use. Suitable protective clothing should be worn to prevent the material from coming in contact with skin and eyes.
RF-008 flux contains a highly flammable chemical solvent with a flashpoint 56F (13C). The flux must not be used near open flames or near non-flameproof electrical equipment.
Highlight : This information herein is based on data considered accurate and is offered at no charge. No warranty is expressed or or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated.