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Low Rosin, Lead Free Wave Flux EF-0008

RODUCT DESCRIPTION EF-0008 is a resin containing flux designed to provide the excellent solderability and reliability in in general and high-density boards in both Lead Free and lead soldering processes. It is designed to have low bridging on bottom side QFP's with 144 -168 leads as well as superior performance in hole fill and solderballing. Additionally, it provides good Lead Free solder joint cosmetics with an evenly spread, tack free residue.

FEATURES & BENEFITS *Good hole-fill demonstrated by >96% yield on 10 mil holes. *Low bridging performance on connectors. *Good micro-solder ball performance in Lead Free applications. *Pin testable

Benefits: *Excellent Lead Free soldering performance on various board finishes. *Evenly spread, tack free residue. *Capable for high density as well as general purpose Lead Free soldering processes. *Can be used in Lead Free or Lead processes.

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Purchase at below Promotion Price for trial sample run: ( in US$ FOB Hong Kong )

Product Unit Per Packing US$/Pack

Low Rosin Lead gallon 5 gallon/barrel US$71 Free Wave Flux EF-0008 specific for wave soldering

APPLICATION GUIDELINES PREPARATION: In order to maintain consistent soldering performance and electrical reliability, it is important to begin the process with circuit boards and components that meet established requirements for solderability and ionic cleanliness. It is suggested that assemblers establish specifications on these items with their suppliers and that suppliers provide Certificates of Analysis with shipments and /or assemblers perform inspection. Analysis wit shipments and/or assemblers perform incoming inspection.

EF-0008 can be applied by spray or foam. When spray fluxing, the uniformity of the coating can be visually checked by running a piece of cardboard over the spray fluxer or by processing a board-sized piece of tempered glass through the spray and then through the preheat section.

EQUIPMENT SETTING OPERATING PARAMETER

Contents	SAC 305	63/37 Sn/Pb
Amout of Flux Applied	Spray: 1200 to 1600g/in solids/in for dual wave	Spray: 1000 to 1200g/in solids/in for dual wave
	solids/in for dual wave and	solids/in for dual wave and
	1000 to1200g/in for single wave soliding	600 to900g/in for single wave soldiing

Top-side Preheat Temp	80 - 100C	75 - 95C
BottomSide Preheat Temp	0 to+40F(0to+22C) vs Top-side	0 to+40F(0 to +22C) vs Top -side
Recommended Preheat Temp	Straight ramp to desired top-side temperature	Straight ramp to desired top-side temperature
Maximum Ramp Rate of Top sideTemp (to avoid component damage)	2C/sec.(3.5F/sec.) max	2C/sec.(3.5F/sec.)max

Conveyor Angle	5 - 8 (6 most common recommended by equipment suppliers)	5 - 8 (6 most common recommended by equipment suppliers)
Conveyor Speed	1.5"C 2.0 meters/min for single wave, 1.8-2.2 meters/min for dual wave EF-0008 is capable of running at a slower conveyor speed to accommodate certain types of lead free wave soldering process.	1.5"C 2.0 meters/ min for single wave, 1.8-2.2 meters /min for dual wave
Contact Time in the solder (includes chip)	1.5-4.0 sec.(2-3 sec most common)	1.5-4.0sec(2-3 sec wave & primary wave)
Solder Pot Temp	255 - 256 C	240 - 250 C

These are general guidelines which have proven to yield excellent results; however, depending upon your equipment, components, and circuit boards, your optimal settings may be different. In order to optimize your process, it is recommended to perform a design experiment, optimizing the most important variables (amount of flux applied, conveyor speed,topside preheat temperature, solder pot temperature and board orientation).

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HEALTH & SAFETY Inhalation of the volatilized flux activator fumes, which are generated at soldering temperatures, may cause headaches, dizziness and nausea.

Highlight : This information herein is based on data considered accurate and is offered at no charge. No warranty is expressed or or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated.